Data Center Cold Plate
Model: IVC-DCC
面向数据中心机柜级高密算力，提供冷板、歧管与快插管路的整体液冷设计，支持单相与两相冷却液，显著降低 PUE。
| Key Specifications | |
|---|---|
| Heat Transfer Area | 定制 |
| Max Temperature | ≤80℃ |
| Max Pressure | 1.0 MPa |
| Material | 铝合金 / 铜 |
| Applications | 数据中心、高性能计算、AI集群 |
Product Details
Overview
The data-center cold-plate solution targets rack-level high-density compute, providing an integrated liquid-cooling design of plates, manifolds and quick-connect piping that supports single/two-phase coolant and markedly lowers PUE.
Features
- Rack-level plate + manifold integrated solution
- Supports single/two-phase coolant
- Quick-connect piping for easy maintenance
- Optional leak detection and safety interlock
Specifications
| Item | Range |
|---|---|
| Heat-transfer area | Custom |
| Design pressure | ≤1.0 MPa |
| Operating temp. | ≤80 ℃ |
| Material | Aluminum / Copper |
Applications
Data centers, high-performance computing, AI training clusters.
