Liquid Cold Plate
Model: IVC-LCP
采用高导热铝合金真空钎焊冷板，内部精密流道将服务器、功率模块、激光器等热源热量高效带走，支持高功率密度散热。
| Key Specifications | |
|---|---|
| Heat Transfer Area | 0.05 ~ 2 ㎡ |
| Max Temperature | ≤120℃ |
| Max Pressure | 1.0 MPa |
| Material | 铝合金 3003/6061 |
| Applications | 数据中心、储能、功率电子、激光器 |
Product Details
Overview
Liquid cold plates are brazed from high-conductivity aluminum with precision internal channels that carry heat away from high-flux sources such as server CPUs, IGBT modules and lasers via coolant — the mainstream thermal solution for high-power electronics.
Features
- One-piece vacuum-brazed construction; flow paths customized to the heat-source layout
- Thermal resistance as low as 0.02–0.05 ℃/W
- Compatible with deionized water, glycol and dielectric fluids
- Optional temperature/flow sensors and quick-connect fittings
- Anodized surface for corrosion resistance and electrical isolation
Specifications
| Item | Range |
|---|---|
| Heat-transfer area | 0.05 ~ 2 ㎡ |
| Design pressure | ≤1.0 MPa |
| Operating temp. | -20 ~ 120 ℃ |
| Base material | Aluminum 3003 / 6061 |
| Coolant | Water / glycol / dielectric |
Applications
Data-center servers, BESS packs, power converters, lasers, EV drivetrains.
